| 发明名称 |
Microencapsulation method microelectric devices made therefrom and heat curable epoxy resin compositions |
| 摘要 |
A method for encapsulating microelectronic devices is provided using a heat curable epoxy composition having a monomeric or polymeric diaryliodonium hexafluoroantimonate salt. Curable compositions are also provided as well as encapsulated microelectronic devices. |
| 申请公布号 |
HK112494(A) |
申请公布日期 |
1994.10.27 |
| 申请号 |
HK19940001124 |
申请日期 |
1994.10.20 |
| 申请人 |
GENERAL ELECTRIC COMPANY |
发明人 |
ERIK WILHELM WALLES;JAMES VINCENT CRIVELLO;JOHN HENRY LUPINSKI |
| 分类号 |
C08G59/00;C08G59/68;C08K3/36;C08L63/00;C09K3/10;H01L21/56;H01L23/29;H01L23/31;(IPC1-7):C08L63/00;B29C43/18 |
主分类号 |
C08G59/00 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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