发明名称 |
SEMICONDUCTOR DEVICE |
摘要 |
A semiconductor device having a structure of high-density connection the pitch of which is less than 150 mu m. The connection electrodes are free from shortcircuit due to conductive adhesive and solder. The connection can be achieved at a high yield. The semiconductor device comprises a substrate having a plurality of connecting electrodes (17); a semiconductor chip having projecting electrodes (15); a conductive adhesive (18) for bonding the connecting electrodes and projecting electrodes; and a flow preventing member (22) arranged between the connecting electrodes on the substrate in order to prevent shortcircuit between the connecting electrodes. |
申请公布号 |
WO9424699(A1) |
申请公布日期 |
1994.10.27 |
申请号 |
WO1994JP00586 |
申请日期 |
1994.04.07 |
申请人 |
CITIZEN WATCH CO., LTD.;KANEKO, YASUSHI |
发明人 |
KANEKO, YASUSHI |
分类号 |
H01L21/56;H01L21/60;H01L23/485 |
主分类号 |
H01L21/56 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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