| 摘要 |
The modular floor sub-structure is provided with discrete floor modules having bottom surfaces and sides extending upwardly to support paired floor tiles. The modules are interconnected to sit upon a floor surface and, in turn, support rack-mounted computer components. Select ones of the floor modules contain air cooling coils and blowers, while others are provided with uninterrupted power supplies and still others retain power distribution networks. The cooling system of a given module as well as the UPS components of another given module are provided having a capacity for supporting one computer component. Where more than one computer component is to be supported by the system, then additional modules are provided to develop an expanded elevated floor surface with power and heat removal servicing specific to each computer component. A step arrangement is provided, the interior of which is utilized to retain flexible chilled water conduits for servicing the cooling coils within adjacently disposed floor modules as well as for providing servicing access to the cooling coils, the UPS system and a power distribution console. The step structure pivots from a seated to an open position to provide service access. <IMAGE> |
