GOLD-ALLOY BONDING WIRE

摘要

A gold-alloy bonding wire comprising a group of elements consisting of 2-10 wt. ppm of scandium, 3-20 wt. ppm of beryllium and 2-50 wt. ppm of indium and the balance consisting of gold and inevitable impurities. This wire serves to secure a loop height of 200 mu m or above and to lower wire deformation after resin sealing to 5 % or below.