Passivierungsverfahren für eine integrierte Schaltung.

摘要

Process for passivating an integrated circuit comprising the formation of at least one final dielectric layer. The process consists in depositing a first layer (9) of a hard dielectric material, in spreading on this layer a viscous dielectric suspension (10) which is stoved, and in depositing on the surface thus obtained a second layer (11) of a hard dielectric material. Application to the passivation of integrated circuits.