| 摘要 |
PURPOSE:To provide a method by which a columnar (in other words, a stacked- form) via (via post) can be easily formed in a thin film multilayered substrate and the density of the via posts can be increased by forming the via post in a thicker dielectric layer. CONSTITUTION:In this method, a via post is formed in such a way that, after a lower-dielectric layer 2 and lower-conductor layer 1 are successively formed on a substrate 3, a first resist 4 is applied to the surface of the layer 1 and a via forming part is opened. Then, after performing first plating 5 on the via forming part, the resist 4 is removed and a second resist 6 having a higher viscosity than the first resist 4 is applied to the surface of the layer 1. After applying the resist 6, the same part as the opened part of the resist 4 is opened and second plating 7 is performed on the opened part. Then the via is formed by connecting the second plating 7 with the first plating 5. |
