| 摘要 |
A plurality of integrated circuit chips 1 each has one or more interconnection pads 2 disposed thereon. A polymer film 4 overlies the integrated circuits 1 and has a plurality of via openings 7 therein. Some of the via openings 7 are aligned with at least some of the interconnection pads 2. A pattern of interconnection conductors 5 disposed on one side of the polymer film 4 connects at least some of the via openings 7, and a conducting substance 8 connects at least some the interconnection conductors 5 to at least some of the interconnection pads 2. The polymer film acts as the sole mounting substrate for the chips. <IMAGE> |
