发明名称 METHOD FOR MOLDING PREFORMAT SUBSTRATE
摘要 PURPOSE:To prevent pit dislocation and double transfer by forming many fine grooves on the surface of a mold opposite to the face of a mold fitted with a stamper and constituting the grooves so as to form a rough surface having specified roughness on the surface of a molded substrate. CONSTITUTION:In a movable mold 11, a stamper 14 for transferring and forming a pit and a laser guide groove is fixed on the surface of a substrate 13 by the internal and external circumferential stamper pressers 15, 16. Grooves are formed on the specified face of the mold. The formation face is opposed to the mold p7 fitted with the stamper 14 and is the face of the mold forming a cavity 19, namely the surface of a stationary mold 12. The grooves are so constituted that a rough surface having roughness wherein Ra is 3-20nm preferably 5-10nm and RmaX is 50-500nm preferably 100-500nm as roughness of the grooves is formed on the surface of the molded substrate. As a result, the substrate sticks firmly on the face wherein the grooves are formed and is not dislocated in a time for molding.
申请公布号 JPH06297514(A) 申请公布日期 1994.10.25
申请号 JP19930093157 申请日期 1993.04.20
申请人 MITSUBISHI KASEI CORP 发明人 MATSUISHI FUJIO;YOKOTA SHOJI
分类号 B29C33/42;B29C45/26;B29C45/37;B29L17/00;G11B5/73;G11B5/738;G11B5/82;G11B7/26;(IPC1-7):B29C45/37 主分类号 B29C33/42
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