Method and apparatus for varying temperature and electronic load conditions of a semiconductor device in a burn-in test chamber while performing a burn-in test

摘要

A burn-in apparatus for use in burn-in tests includes a burn-in test container for accommodating a plurality of semiconductor device. Also, the burn-in apparatus includes a measuring device for individually measuring junction temperatures of semiconductor chips of the respective semiconductor device by detecting electric characteristics of temperature sensors built in the semiconductor chips, and a temperature adjusting device for controlling amounts of heat radiation and conduction of the semiconductor chips. The temperature adjusting device, such as device for controlling air flow rates of air nozzles of the container, is controlled by control device on the basis of outputs of the measuring device. Thus, the junction temperatures can be kept within a predetermined temperature range to thereby improve the accuracy of screening tests.