发明名称 PREPREG FOR COMPOSITE BASE PLATE AND COMPOSITE COPPER-CLAD LAMINATE
摘要 PURPOSE:To provide a composite copper-clad laminate and a prepreg for composite base plates having excellent mechanical properties, electric properties and mechanical processability. CONSTITUTION:A composite copper-clad laminate which comprises heat-resistant fibers, a hydrolytic condensate of an organosilicon compound of the general formula: RmSiXn (R is a functional group; X is readily hydrolyzable group; m and n are integers of 1 to 3, respectively; m+n is 4), and a resin where the hydrolytic condensate contacts with a plurality of fibers to bind them and all of the spaces between fibers bonded to one another are substantially filled with the resin and the resultant pressed prepreg is laminated with glass cloth layers on both surfaces, further cladded with a copper-foil layer thereon, respectively.
申请公布号 JPH06298965(A) 申请公布日期 1994.10.25
申请号 JP19930113737 申请日期 1993.04.16
申请人 HONSHU PAPER CO LTD 发明人 TAKAGUCHI SHINICHIRO;TOYOSHIMA SETSUO
分类号 B32B15/08;B32B17/04;C08J5/24;D04H1/587;D06M13/02;D06M13/50;D06M13/51;D06M13/513;D06M101/00;D21H17/59;H05K1/03 主分类号 B32B15/08
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