摘要 |
PCT No. PCT/JP90/01039 Sec. 371 Date Apr. 15, 1991 Sec. 102(e) Date Apr. 15, 1991 PCT Filed Aug. 13, 1990 PCT Pub. No. WO91/02999 PCT Pub. Date Mar. 7, 1991.Disclosed is an active-matrix addressed TFT substrate using a thin film transistor, a manufacturing method and an anodic oxidation method thereof, a liquid crystal display panel using the TFT substrate and a liquid crystal display equipment using the liquid crystal display panel. In the TFT substrate, Cr or Ta is used for gate terminals, aluminum or a metal mainly composed of aluminum is used for gate bus-lines extending therefrom, for gate electrodes, and for electrodes of thin film capacitors (additional capacitance, storage capacitance), and an anodic oxidized film composed of the metal and free from defect is used for at least one of gate insulators, dielectric films of the thin film capacitances and interlayer insulating films for the intersections between the bus-lines. Also disclosed is a method of selectively forming an anodic oxidized film on an aluminum pattern. That is, in a case of forming a selective oxidation mask to a desired region on the aluminum pattern with a positive type photoresist, in the present invention, an angle ( theta ) formed between the selective oxidation mask and the aluminum pattern is made as: theta >/=110-20T (T: film thickness of the positive type photoresist).
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申请人 |
HITACHI, LTD. |
发明人 |
YAMAMOTO, HIDEAKI;MATSUMARU, HARUO;TANAKA, YASUO;TSUTSUI, KEN;TSUKADA, TOSHIHISA;SHIRAHASHI, KAZUO;SASANO, AKIRA;MATSUKAWA, YUKA |