发明名称 Method for manufacturing a panel switch attached to electronic apparatus
摘要 A method for manufacturing a panel switch comprises of the steps of respectively mixing first and second adhesives which have no adhesive quality at a room temperature and have adhesive quality at a moderate temperature, printing an upper contacting point on one side of an upper sheet, printing the first adhesive on one side of the upper sheet to surround he upper contacting point, transforming the upper contacting point in a hemisphere form swelling toward the upper sheet;, printing a lower contacting point on one side of a lower sheet, printing the second adhesive on another side of the lower sheet, assembling a reinforcing plate, the lower sheet and the upper sheet in that order for the upper contacting point to face the lower contacting point, and simultaneously heating both the first adhesive layer and the second adhesive layer. In this case, the upper sheet is adhered to the lower sheet through the first adhesive, and the lower sheet is adhered to the reinforcing plate through the second adhesive.
申请公布号 US5358579(A) 申请公布日期 1994.10.25
申请号 US19930010692 申请日期 1993.01.29
申请人 MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. 发明人 TANABE, KOJI
分类号 C09J5/06;H01H13/702;(IPC1-7):B32B31/00 主分类号 C09J5/06
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