| 摘要 |
<p>A procedure as well as a device for soldering by means of a laser beam (7) are described, the heat radiation (17) emitted from the soldering point (6) being measured, differentiated and monitored for a reduction in the increase, this reduced rise being recognized as the start of the wetting action after melting of the solder (5), and the heat supply by the laser beam (7), in accordance with the complete wetting or combining of the soldering liquids, being ended after a preselectable time interval DELTA t2. <IMAGE></p> |
