| 摘要 |
<p>PURPOSE:To make it possible to separate reliably a prescribed chip only without inflicting damage to the semiconductor chip by a method wherein after the adhesive force of an adhesive sheet is reduced by sliding pins with the points formed into a curved surface in the state of normal pressures, separation of the chip is made to perform by thrusting-up pins with the points formed into a plane. CONSTITUTION:A DC motor 13 is actuated in a state that a cam 14a is cut off from the motor 13 and in a state that a cam 14b is coupled with the motor 13. The cam 14b has a plurality of recesses and projections, this cam 14b is rotated and a transfer bar 7b repeatedly performs slides to left and right. With these slides, sliding pins 5b are also reciprocated to left and right, rub and adhesive sheet 17 stuck with a prescribed chip 16 to be separated from the rear of the sheet 17 and weaken the adhesive force of the sheet 17 with the semiconductor chip 16. After that, a DC motor 11 is actuated and separating pins 5 are further made to rise. Thrusting-up pins 5 and the sliding pins 5b are both made to rise and the chip 16, which is in the state of normal pressures and at the same time, is weakened in its adhesive force with the sheet 17, can be completely separated.</p> |
