SEMICONDUCTOR MANUFACTURING DEVICE

摘要

PURPOSE:To avoid the bonding of a semiconductor element onto a pressure jig and stably give even pressure force to all of electrodes of the semiconductor element. CONSTITUTION:A conductor wiring provided on a substrate 1 is aligned with an electrode of a semiconductor element 3 which is pressurized against the substrate 1 by a pressurizing jig 6 through the intermediary of a bonding agent to be electrically pressure-connected so that a film 13 with one end thereof connected to a feeding reel 11 and the other end thereof connected to a winding reel 12 may be provided between the pressurizing jig 6 and the semiconductor element 3 to wind up the film 13 by turning at least the winding reel 12.