CHIP TYPE THERMISTER AND PRODUCTION THEREOF

摘要

PURPOSE:To produce a highly reliable chip type thermister excellent in solderability and soldering heat resistance in which fluctuation of resistance due to plating of enclosing electrode is suppressed easily at low cost. CONSTITUTION:A chip body stamped out from a green sheet for thermister is fired to produce a thermister body 10 and internal electrodes 11 are formed at the opposite ends of the body 10 while wrapping them. The body 10 is then coated with a dielectric inorganic layer 14 of 0.1-10mum thick over the entire surface thereof. A conductive paste containing a metal powder and an inorganic coupler is applied to the opposite end parts of the body 10 while wrapping them over an area smaller than the internal electrode and then the paste is fired at a temperature lower than the melting point or softening point of the inorganic layer. Consequently, a part of the underlying inorganic layer is fused to the inorganic coupler in the paste thus forming an external electrode 16. Subsequently, plating layers 18, 19 are formed on the surface of the external electrode.