| 摘要 |
<p>PURPOSE:To eliminate the deviation between an electrode and a thermoelectric semiconductor element, and to prevent wasteful heat generation by a method wherein, when a skeleton type thermomodule is manufactured, adhesive resin is applied to a supporting member, an electrode is arranged thereon, and the electrode is firmly fixed to the adhesive resin. CONSTITUTION:A double-sides tape 12, on which adhesive resin is applied, is glued on a hard supporting board 11 made of metal, ceramic and the like. An electrode 13 is arranged on the prescribed position of the above-mentioned double-sided tape 12. The electrode 13 is coated with a conductive bonding agent or cream solder 14. A thermoelectric semiconductor element 15 is arranged thereon. An electrode 17 is formed on a ceramic substrate 16 which is prepared independently. This electrode 17 is coated with a conductive bonding agent or cream solder 14. The prepared ceramic substrate 16 is turned inside out and placed on the prepared material. The ceramic substrate 16 is heated up and the conductive bonding agent or the cream solder is dissolved, everything is fixed by cooling. The adhesive resin of the double-sided tape is expanded by dipping into the organic solvent such as acetone and the like, and the supporting board 11 is taken out from the electrode.</p> |
