发明名称 MOUNTING METHOD FOR WIRING BOARD WITH INSERTION-TYPE COMPONENT
摘要 <p>PURPOSE:To enable an insertion-type component such as a fuse holder or the like large in heat capacity to be easily and surely connected to a wiring board by soldering. CONSTITUTION:Cream solder is applied onto an insertion-type component mounting electrode 11 and a chip-type component mounting electrode 13 of a wiring board 10 through printing. A terminal 15a of a fuse holder 15 is inserted into a through-hole 12 provided to the insertion-type component mounting electrode 11, and a chip capacitor 16 is placed on the chip-type component mounting electrode 13. Then, cream solder applied onto the wiring board 10 is molten by reflow soldering to feed a part of solder 14a into the through-hole. Moreover, the rear side of the wiring board 10 is brought into contact with a solder tank to supply solder into the through-hole. As mentioned above, solder is fed in two steps to a wiring board from both above and below, whereby the through- hole is filled with solder, and a fuse holder is surely connected to a wiring board by soldering.</p>
申请公布号 JPH06296079(A) 申请公布日期 1994.10.21
申请号 JP19930106090 申请日期 1993.04.07
申请人 IBIDEN CO LTD 发明人 YAMADA KAZUHITO
分类号 H05K3/34;H01H85/20;H01H85/22;(IPC1-7):H05K3/34 主分类号 H05K3/34
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