| 摘要 |
PURPOSE:To improve a block bonding operation in workability when two blocks which are separately formed of ceramic board are bonded together to form a multilayer wiring board. CONSTITUTION:A first multilayer wiring board block 100 wherein a ceramic board 1 serves as a base and a second multilayer wiring board block 200 wherein a photosensitive glass 11 serves as a base are manufactured in parallel with each other. Corresponding solder bumps 6 and 16 provided to the blocks 100 and 200 respectively are made to abut against each other to bond the blocks 100 and 200 together with insulating adhesive agents 5 and 15. Thereafter, the photosensitive glass 11 is irradiated with ultraviolet rays and removed by dissolution with acid. Therefore, photosensitive glass and ceramic are nearly equal to each other in thermal expansion coefficient, and two blocks are hardly broken at bonding, so that the blocks with glass can be bonded together and the workability is enhanced. |
