| 摘要 |
PURPOSE:To provide a method for inspecting the profile of a lead led out from the peripheral part of mold resin highly accurately without taking out the semiconductor device from a tray. CONSTITUTION:An optical camera 3 for picking up the image of a lead is disposed in a region on the outside of an imaginary border L1 passing through the upper bent part 2b and the end part 2c of the lead while directing from the mold resin 1 side toward the lead 2. Arranging pitch and waving of the end of lead are detected based on the image of lead picked up by means of the optical camera 3. |
