| 摘要 |
PURPOSE:To enable a semiconductor device to be made thinner and the cost thereof cut down by a method wherein the semiconductor device is structured so that a circuit substrate and a semiconductor chip may be provided with a part where they are flatly overlapped with each other and the chip has bumps with no junction with the part. CONSTITUTION:A bump 4a formed on a semiconductor chip 1 is bonded either to a lead wire 3-c or 3-a, however, another bump 4b also formed on the semiconductor chip 1 has no junction with the lead wires at all. On the other hand, the other bump 4-c formed on the semiconductor chip 1 has no junction part of the conductor member with a circuit in the semiconductor to be electrically insulated. This bump 4-c is flatly overlapped with a circuit substrate through the intermediary of the lead wires. Furthermore, the area of the lead wire overlapped with the bump 4-c is made wider than the other areas so that said bumps may be positioned on the lead wires without fail even if the semiconductor chip 1 is moved a little bit thereby enabling the distance between the edge of the semiconductor chip 1 and the lead wires to be kept constant. |
