| 摘要 |
PURPOSE:To prevent a defective board from being manufactured by a method wherein it is indirectly detected by detecting an extension pin jointed to a lead wire by a sensor which detects that a lead wire is inserted into an insertion hole of a printed board or not, and the imperfectly inserted lead wire of an electronic component is not subjected to a cutting-bending operation. CONSTITUTION:A cutting-bending device is equipped with a stationary edge 22 fixed to the body 21 of the device, a movable edge 23 which cuts and bends the lead wire 1A of an electronic component 1 together with the stationary edge 22, a holder 24 possessed of a support hole 27 which receives an extension pin 3 joined to the lead 1A, sensors S1 and S2 which detect that the extension pin 3 is inserted or housed in the holder 24 or not, and the lead wire 1A is cut and bent only when the extension pin 3 is detected by the sensors S1 and S2. |
