Excimer-induzierte flexible Zusammenschaltungsstruktur.

摘要

A raised metal connection feature (29) is created by forming a conductive pad (17) on a flexible substrate (11) and applying a flexible dielectric insulator (19) and photoresist layer (21) over the conductive pad (17). An excimer laser (25) is used to ablate a via (27) through the dielectric insulator (19) and photoresist (21) to the conductive pad (17). Gold or other metal is then plated up in the via (17), and the photoresist (21) is removed, leaving a metal feature (29) extending above the dielectric insulator (19).