MANUFACTURING ELECTRONIC DEVICES COMPRISING, E.G., TFTS AND MIMS

摘要

Body portions (36) of semiconductor crystalline silicon material of sufficient quality to form high-mobility TFTs (thin-film transistors) and other semiconductor devices of a driver circuit are formed by depositing on a substrate (14) a layer of insulating silicon-based non-stoichiometric compound material (32) and then converting this material (32) into the semiconductive crystalline material (36) by heating with an energy beam (40), for example from an excimer laser. The use of an energy beam (40) permits easy localization of the heating (and consequent conversion) both vertically and laterally. The deposition (e.g. by plasma-enhanced chemical vapour deposition) and the beam annealing can both be carried out without heating the substrate (14) to high temperatures, and so a glass or other low-cost substrate (14) can be used. An unconverted part (32a) underlying the crystalline silicon body portion (36) can form at least part of a gate insulator of the TFT. The deposited non-stoichiometric compound material may be of a type suitable for forming a MIM-type switching device so that unconverted areas (42) of the insulating material (32) may be retained for that purpose. This permits the fabrication of an LCD device comprising a picture-element array of MIM type devices in the unconverted material (32) of the layer and TFT driver circuitry in the crystalline silicon material (36) of the layer.