发明名称
摘要 PURPOSE:To enable a wiring board to be divided into unit wiring boards to be taken out after required electronic components are mounted on the unit wiring boards by a method wherein a metal core is cut out along a cut line between unit boards adjacent to each other to provide a slit section, and the slit section is filled with an insulating material capable of being cut out. CONSTITUTION:A slit 12 possessed of required width and length and a through- hole 16 provided with a required diameter are provided to a metal core printed wiring board 10C, the slit 12 is filled with an insulating filler 13, and, for instance, a V-shaped groove 18 is provided to a center line section, And, a hole of the through-hole 16 is filled with the insulating filler 13, the insulating filler 13 is made to be left as thick as required, and connecting conductor layers 17 are provided to the peripheral part of the insulating filler 13 so as to connect the upper and lower conductor layers 15 with each other. By these processes, the metal core printed wiring board 1C are easily divided into unit wiring boards after electronic components are mounted on the wiring board 10C.
申请公布号 JPH0682903(B2) 申请公布日期 1994.10.19
申请号 JP19880125677 申请日期 1988.05.25
申请人 IBIDEN CO LTD 发明人 YAMAMOTO TSUKASA;TAKAHASHI SHINJI;SUGYAMA SUNAO
分类号 H05K1/05;H05K3/00;H05K3/44;(IPC1-7):H05K1/05 主分类号 H05K1/05
代理机构 代理人
主权项
地址
您可能感兴趣的专利