Adhesive agent for substrate of electroless plating, printed circuit board using same, and method of producing same

摘要

Adhesive agent for substrate of electroless plating characterized in comprising epoxy resin, synthetic rubber, and phenolic resin as main components, a hardener of the epoxy resin, inorganic filler having hydroxyl group, and solvent. The adhesive agent is hardened at relatively low temperature (about 150 DEG C.) in short period (within 30 minutes) without giving warp and distortion to the insulation substrate, and moreover its insulation resistance after hardening is high. The adhesive agent is preferable as an adhesive agent for a printed circuit board.