| 摘要 |
PURPOSE:To provide a circuit board of a structure, wherein the high density of patterns is obtained and at the same time, a wire bonding can be reliably executed and a short-circuit between wirings is never generated. CONSTITUTION:In a circuit board 10, which consists of electronic component mounting parts 12, which are extended in the longitudinal direction on the surface of the board, and a plurality of conductive patterns 14a, which are extended in parallel to one another along the mounting parts 12, and is provided with electronic components 13 connected electrically with each conductive pattern 14a by wire bonding, each conductive pattern 14a is distributed in a stepwise form at a wire bonding region. Stepped step parts 14b of the patterns 14a are extendedly formed in consideration of the sag of bonding wires and at the same time, the step parts 14b are constituted in such a way that they are extended a little obliquely to the mounting parts 12 for making the respective step part 14b locate from the mounting parts 12 at roughly the same distance as that between the mounting parts 12 and the patterns 14a of the respective step parts 14b. |
