| 摘要 |
PURPOSE:To provide the multi-layer high frequency circuit whose miniaturization is realized. CONSTITUTION:This circuit is provided with a strip line 1 embedded in a dielectric 2 having ground electrodes 3, 4 in the upper and the lower parts, a wiring 7 and an electric circuit part 8 formed on a dielectric 5 on the upper ground electrode 3, and a via hole 6 for connecting electrically the strip line 1 and a DC bias circuit 8 by allowing them to pass through the upper ground electrode 3, and having a high frequency attenuation characteristic, therefore, it is effective for miniaturization, and also, a sneak path of a high frequency signal to a DC circuit does not exist, therefore, the performance of a high frequency characteristic is improved. |
