发明名称 Headphone assembly
摘要 A headphone assembly adapted for engaging a user's head includes an adjustable headband having first and second ends. A right ear piece is attached to a first end, and a left ear piece is attached to a second end of the headband. Each ear piece is substantially semi-circular shaped, and has a substantially inverted U-shaped shell having an inverted U-shaped inner wall. The U-shaped inner wall defines an acoustic cavity having a bottom end opening for receiving approximately the top half of the user's ear. A rear wall of the acoustic cavity has a number of holes extending therethrough behind which a speaker is mounted. An inverted U-shaped chamber is provided about the acoustic cavity and the outer perimeter of the ear piece. The right ear piece chamber will hold the electronic circuitry necessary for a cordless receiver. The left ear piece has a similar chamber which accepts a power board for holding a plurality of batteries which provides the power source for the electronic circuitry mounted in the opposite ear piece. A dome-shaped cover plate covers each of the speaker elements and the respective power board and circuit board, to create a cordless headphone wherein the user's ear is only partially enclosed by the ear piece. Foam pads mounted on the ear pieces contact the user's head to provide comfort to the user.
申请公布号 US5357585(A) 申请公布日期 1994.10.18
申请号 US19930088685 申请日期 1993.07.09
申请人 KHYBER TECHNOLOGIES CORPORATION 发明人 KUMAR, RAJENDRA
分类号 H04R1/10;H04R5/033;(IPC1-7):H04R25/00 主分类号 H04R1/10
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