| 摘要 |
PURPOSE: To remove drillings from through-holes of a printed circuit board, using an incombustible and nonexplosive solvent without breaking the ozone layer by forming additive circuits. CONSTITUTION: Holes are bored through a printed circuit board to form vias and through-holes. The circuit board is blasted with vapor to remove granular fragments and then dipped in a solvent to swell drillings, the solvent is removed by a gas and an oxidizer water soln. is passed through the holes to remove the swollen drillings from the through-holes. After water washing, a reducing agent water soln. is passed through to reduce and remove the acid oxidizer, the circuit board is washed with water to remove the reducing agent, seeds are formed on the circuit board surface to form circuits on the circuit board by the photolithography, and additive plating is applied to the surface circuits and plated through-hole circuits. |
