| 摘要 |
PURPOSE:To provide a method of manufacturing a printed wiring board in which the burr and the separation of a copper-plated layer are not caused and which has a semithrough hole whose connection reliability is high. CONSTITUTION:A part of a soft copper-plated layer 3 is removed in advance in the axial direction of a through hole 4 which becomes the edge of a semithrough hole 14, the burr and the separation of the copper-plated layer 3 are prevented from being caused by the rotation of a rooter bar 7 in a rooter working operation, and a printed wiring board which has the through hole 14 whose connection reliability is high is obtained. |
