| 摘要 |
PURPOSE:To lower the cost of the title manufacture and to make its maintenance and its control easy by a method wherein a metal mold is used in common as much as possible and the number of metal molds is reduced. CONSTITUTION:Many matrix-shaped via holes are made in a green sheet 10 by using a metal mold for via-hole making. Then, out of conductors which have been buried in the via holes 12 via a conductor paste 14, the conductors used for connection of wiring patterns between the upper and lower layers are exposed to the outside as they are, and the conductors not used for the connection are covered with insulating layers 16. Consequently, only the conductors required for desired wiring patterns are selected, and the residual conductors are covered with the insulating layers 16 and set in a non-connection state. Thereby, the title manufacture can be applied to a plurality of kinds of wiring patterns. |
