| 摘要 |
PURPOSE:To provide a die bonding equipment capable of properly arranging a rectangular LED array chip with LED elements disposed at a high density on a substrate and capable of producing die bond. CONSTITUTION:A die bonding equipment 1 comprises two optical systems 20a and 20b for optically enlarging predetermined portions of a substrate 9 and an LED array chip 8, and a pattern recognition system 3 for recognizing the positions of the substrate 9 and LED array chip 8 from two images obtained from these optical systems 20 a and 20b and also for sending signals for determining the predetermined arrangement to the controller of an adjustment stage 10. |
