| 摘要 |
PURPOSE:To easily apply a minimum volume of adhesive to the portions where semiconductor elements of inner lead are to be fixed by rotating a coating roll on which an insulating adhesive is coated while moving this coating roll or a lead frame horizontally. CONSTITUTION:A lower portion of a coating roll 12 is dipped in an adhesive 11 placed in a liquid container 13, and a control plate 14 for controlling the coating thickness of the adhesive 11 is disposed near the coating roll 12. Then, a lead frame 1 is sent horizontally while rotating the coating roll 12 by pressing roll 15 against the lead frame, thereby sequentially coating the adhesive to the lead frame 1. By doing this, the coating layer of the adhesive 11 can be made thinner with a minimum volume without striding the whole of a plurality of inner leads disposed in parallel. |
