发明名称 |
PREPARATION OF ELECTRON EMISSION FILAMENT ASSEMBLY AND FILAMENT ASSEMBLY |
摘要 |
<p>PURPOSE: To provide an electron emitting filament assembly which can highly reliably work at high operation temperature and can be manufactured at high production yield through a lessened number of manufacturing steps and provide a method for manufacturing the assembly at low cost. CONSTITUTION: Parts of a first and a second conductive posts 26, 28 are air tightly fixed in a mold cavity forming a base 70. A molten compound is supplied to the cavity and cured to capsulate and enclose the posts to form a base in the surrounding of the posts. When the electric current applied from the first post 26 reaches the second post 28 through the filament 72, a filament made of a material which can emit electrons in controlled supply amount is selected and the filament is electrically connected between the first post and the second post.</p> |
申请公布号 |
JPH06290705(A) |
申请公布日期 |
1994.10.18 |
申请号 |
JP19940067557 |
申请日期 |
1994.03.11 |
申请人 |
HEWLETT PACKARD CO <HP> |
发明人 |
MITSUCHIERU SHII BAAHAMU;JIEIMUZU II SHIYUTAINAA;TOOMASU SHII KURISUTENSEN |
分类号 |
H01J1/18;B29C45/14;H01J5/54;H01J9/04;H01J49/08;(IPC1-7):H01J9/02 |
主分类号 |
H01J1/18 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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