| 摘要 |
PURPOSE:To provide a method of manufacturing printed circuit substrates of three dimensional composition. CONSTITUTION:In order to manufacture printed circuit substrates connected by a flexible sheet provided with the wiring part wherein circuit substrate parts are connected to respective circuit parts of the circuit substrate parts, a carrier sheet 50 wherein a circuit pattern 55 comprising a circuit part and a wiring part is formed to form a notch in the sheet is arranged so as to locate the circuit pattern 55 of the circuit part inside a cavity 33 corresponding to the circuit substrate part. Next, the inside of the cavity 33 is filled up with a melted down resin to form the circuit substrate part integrated with the circuit pattern 55 as well as the carrier sheet 50 in the circuit substrate edge part in the part encircled by the notch is heated by thermal welding heaters 45 in a metallic mold so as to be welded into the circuit substrate edge part later to remove the carrier sheet 50 from the circuit substrate part leaving the part encircled by the notch intact. |
