| 摘要 |
<p>The semiconductor package is disclosed including a PCB on which a lead pattern having a contact, a pad and a inner lead is formed, an IC chip mounted on the PCB, a chip-on-board consisting of a metal wire used for wire bonding, and a resin seal for sealing the peripherical region of the board, another chip-on-board having the same construction as that of the aforementioned chip on board, and an insertion member connecting the contacts of the chip-on-boards with each other, thereby increasing the packing density.</p> |
