| 摘要 |
The ceramic package includes a die frame on which a chip is mounted, another die frame on which an inner pattern is formed, a seal ring and a cover, such that the inner pattern is extended to a portion of the seal ring, both edges of the seal ring have an inclined shape, and the cover and both edges of the seal ring are in contact with each other, thereby improving the adhesion of the ceramic package and the cover.
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