摘要 |
<p>The present invention relates to a process for manufacturing a chip card, and a chip card manufactured according to this process. According to the invention the electronic module (1) which is to contain the chip card is formed by constructing the electronic circuit from a prestamped metal strip preformed so as to offer contacts (10), and on which the electronic chip is soldered and wired; covering the said electronic circuit with a resin; and, when moulding the card, a pressure P is applied to the mould (103) so as to tightly pinch the electronic module (1) between the latter's castings, and ensure its retention in positioning and locking means, and the flattening of its contacts (10) against the inner wall of the mould. …<IMAGE>… </p> |