Device for enclosing of electrical or electronical components or component groups and enclosing of electrical or electronical components or component groups.

摘要

The component (B1) or the assembly is accommodated in a housing (G1) which is assembled from at least two housing parts (GU1, GO1) and from which connecting legs (A1) are guided to the exterior. In order to increase the sealing effect and hence to protect against internal corrosion, an outer capsule (Ak1) of a thermoplastic synthetic material is integrally formed by injection moulding at least in the region of the joint point (F1) of the housing (G1) and in the region where the connecting legs (A1) emerge from the housing (G1). …Particularly in the case of the hermetically sealed encapsulation of surface-wave filters, sections, which are welded to the outer capsule, having a small wall thickness are formed on the housing parts, circumferentially in their peripheral region. ……