| 摘要 |
A method of affixing a passive dielectric component to a printed circuit board comprising the steps of forming a metallised area on the p.c.b. separate from the printed electrical circuitry, forming a like metallised area on the component, applying solder material to one of the metallised areas, placing the component on the metallised area on the board and reflowing the solder to create a metal-solder-metal bond between the component and the p.c.b. whereby the component is accurately aligned with respect to the printed electrical circuitry on the p.c.b.
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