Probe assembly for testing integrated circuit devices

摘要

A probe assembly adapted to test an integrated circuit (IC) device whose contact pads are deployed in a predetermined pattern in a common plane. The assembly includes a film membrane having a planar dielectric contactor zone and an array of suspension wings radiating from this zone. The wings are clamped at their ends by a mounting ring surrounding a port in a printed circuit board which exposes the contactor zone suspended below the board to the IC device to be tested, the ring being secured to the board. Deployed in a matching pattern on the exposed face of the contactor zone and cantilevered therefrom to assume an angle with respect thereto are spring contact fingers that are extensions of traces running along the wings of the membrane to leads on the printed circuit board. These leads extend to respective test terminals on the board which are connectable to electronic instrumentation for conducting tests on the IC device. When the IC device is raised to bring its contact pads into engagement with the spring fingers, this action causes the fingers to flex inwardly, and in doing so to scrub the contact pads and thereby ensure effective electrical contact therewith.