| 摘要 |
<p>PURPOSE:To make it possible to mass-produce a product excellent in various characteristics by a method wherein a non-contact module, adhesive sheet and one resin plate are piled up so as to be registered in a recessed part, which is produced on at least the other resin plate, and finally pressed under heat after the broken line cutout in the adhesive sheet is cut off. CONSTITUTION:In order to manufacture the non-contact IC card connected, a recessed part 4 is formed on at least one resin plate 2 out of a pair of or front rear resin plates 1 and 2. Further, on adhesive sheet 10 for bonding both the resin plates 1 and 2, broken line cutout conforming to the shape of a non- contact IC module 3 is formed. Next, the non-contact module 3, the adhesive sheet 10 and the other resin plate 1 are piled up so as to be registered in the recessed part 4 in order to be pressed. In succession, the broken line cutout is completely cut off and, at the same time, the resultant pile is pressed under heat, resulting in bonding both the resin plates 1 and 2 and the non-contact IC module 3 together into an integral body. Thus, the non-contact IC card, which is equipped with enough mechanical strength and airtightness, excellent in reliability and manageability and, at the same time, has fine outer appearance, can be mass-produced at high quality.</p> |
