| 发明名称 |
Direct jump engineering change system |
| 摘要 |
A multi-layer interposer in which the X-Y engineering change wiring pattern in the interposer terminates in a pattern of pads on the upper surface of the interposer around the periphery of the chip. In order to make an engineering change, a jumper wire connect pads on adjacent interposers mounted on the multi-chip module.
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| 申请公布号 |
US5354955(A) |
申请公布日期 |
1994.10.11 |
| 申请号 |
US19920984608 |
申请日期 |
1992.12.02 |
| 申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
GREGOR, LAWRENCE V.;MCALLISTER, MICHAEL F. |
| 分类号 |
H01L21/48;H01L23/538;(IPC1-7):H05K1/00 |
主分类号 |
H01L21/48 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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