| 摘要 |
PURPOSE:To produce a gold bonding wire whose high loop height is secured and wire strength is increased and also by which the occurrence of flow after sealing is minimized. CONSTITUTION:This wire has a composition containing, as first-group elements, 1-10ppm, by weight, strontium, 1-20ppm berylium, and 1-50ppm indium and having the balance high-purity gold with inevitable impurities or has a composition containing, besides the first-group components, 1-5ppm, by weight, of calcium and/or yttrium or 1-10ppm of one or >=2 kinds among scandium and rare earth elements as second-group additive elements and having the balance high-purity gold with inevitable impurities in gold. By this method, the fine gold alloy wire, capable of increasing loop height even if ball size is miniaturized at the same wire diameter or a diameter of wire is reduced, can be obtained. |
