THICK FILM CIRCUIT BOARD AND PRODUCTION THEREOF

摘要

PURPOSE:To provide a thick film circuit board which can pass relatively high current despite of high density wiring without sacrifice of reliability or circuit characteristics by forming a circuit of conductors having high aspect ratio arranged at a short interval. CONSTITUTION:In the thick film circuit board employing a cured photosensitive resin in the insulation layer between conductors, the conductor has rectangular cross-section with the fluctuation of thickness in the breadthwise direction being set within 120% of average value and the height in the cross-section of the conductor being set at 20mum or above. The cured photosensitive resin employed in the insulation layer is composed of an ethylene unsaturated compound monomer and a prepolymer having an ethylene unsaturated bond where the ethylene unsaturated bonding concentration is 101-2-2X10<-4>mol/g the molecular weight is 1500-50000.