SURFACE TREATING METHOD FOR CIRCUIT BOARD

摘要

PURPOSE:To secure insulating reliability between copper circuit patterns by decreasing deterioration of insulation between the patterns without consuming a large quantity of water. CONSTITUTION:The method for surface treating a circuit board comprises the steps of pickling the board, then washing the board and then acid treating a copper circuit on a surface of the board. In order to treat in this manner, the board is pickled with acid solution containing sulfuric acid as a base. Impurity ions remaining on the surface of the board can be reduced.