| 摘要 |
<p>PURPOSE:To enable a bonding agent to be coated evenly in the chip bonding step. CONSTITUTION:Within the dispenser part of a chip bonding device, when a dispenser 21 discharges a bonding agent 18 contained in a syringe 28 out of its nozzle 29 to coat the tabs 17 of a lead frame 3, this nozzle 29 actuates according to the previously programmed data to successively coat respective coating points of the tabs 17. At this time, the coating points are specified either by cursor movement on a monitor picture surface or by read-out selection, etc., of the data inputted in a floppy disc. Through these procedures, the nozzle 29 need not be replaced even if the chip size is changed thereby enabling the dispersion in the coating amount due to the replacement of the nozzle 29 to be avoided making the even chip bonding step feasible.</p> |
