| 摘要 |
<p>PURPOSE:To evade the generation of short-circuit by ensuring the space between wires without changing the pitch between I/O cells, in a semiconductor device wherein the I/O cells are arranged in the peripheral part on a semiconductor chip provided with an inner cell region. CONSTITUTION:In a semiconductor device wherein I/O cells 3 are arranged in the peripheral part on a semiconductor chip 1 provided with an inner cell region 2, bonding pads 4 to be arranged in the I/O cell 3 are arranged in positions which are adjacent to the inner cell region 2 and distant from the peripheral edge of the semiconductor chip 1, and connected with leads 5 of an outer circuit via bonding wires 6.</p> |
