| 摘要 |
PURPOSE:To readily manufacture a high frequency module wherein unnecessary radiation is hardly generated by shielding an entire. CONSTITUTION:A lead is connected to a packaging circuit board. Then, the packaging circuit board is covered with an insulation member 14 by projecting the lead from a side surface. Thereafter, leads 13a to 13d are cut from an edge face of the formed insulation member 14 and a metallic film 16 is formed all over the insulation member 14. The metallic film 16 in a periphery of the leads 13a to 13d is cut off and the part of the metallic film 16 including the leads 13a to 13d is formed to electrodes 17a to 17h. |
